Babak Jamshidi

Employer:	Lux Capital Management LLC.
Position:	Analyst
Time period:	May 2008 - Present
Description:	• Performed deal sourcing and business opportunity evaluation. • Evaluated markets and technologies for ongoing deals in semiconductor and cleantech industries. • Contacted the co founders for further opportunity evaluation and due diligence.

Employer:	nPrintSolutions
Position:	Marketing Lead
Time period:	December 2007 - Present
Description:	A nanoimprinting technology to fabricate electronics on flexible substrates. • Performed operations and product diligence to seek partnership with major PV cell manufacturers. • Worked with a team of professors, researcher and MBA students from UC Berkeley.

Employer:	Silicon Clocks
Position:	Market Analyst
Time period:	September 2007 - December 2007
Description:	• Reviewed and evaluated various attributes of timing component market. • Identified and categorized the potential customer to define the product attributes. • Performed pricing diligence for Silicon Clocks technology.

Employer:	PAX Scientific
Position:	Market Analyst
Time period:	June 2007 - August 2007
Description:	• Prepared a complete technology report on the state-of-the-art and competitive technologies. • Evaluated, analyzed and categorized the potential markets based on PAX value propositions. • Provided business and technical recommendations on how to position the company in identified niche markets and achieve large market penetration as a cleantech venture.

Employer:	Toyota Technical Center
Position:	MEMS Specialist
Time period:	May 2006 - August 2006
Description:	• Performed a full scale project on MEMS wafer level packaging design, optimization and fabrication processes to be compatible with the next generation of automotive sensors. • Performed a comprehensive MEMS technology investigation to enhance Toyota sensor platforms.

Employer:	Berkeley Sensor and Actuator Center (BSAC), University of California, Berkeley
Position:	Graduate Student Researcher
Time period:	January 2003 - Present
Description:	• Designed, microfabricated and tested novel and high-resolution poly-crystalline Si-based, SiC-based and SiC-passiavted resonant and capacitive sensors for applications at aggressive environments • Performed extensive operations in clean room, using etching equipment, testing and inspection instruments, and variety of deposition tools to deposit thin films ranged from nano to micron scale. • Fabricated accelerometers and sensors at various size substrates from die size up to 4” and 6” wafers. • Designed and built heat sink and experimental setups to test the sensors at 600°C and dry steam.

Employer:	University of California, Berkeley
Position:	Graduate Student Researcher (SUGAR)
Time period:	January 2002 - December 2002
Description:	• Developed computational elements to model MEMS structures in MEMS simulation CAD program. • Collaborated with computer science researchers to include the warping effect in the beam element design.

Employer:	Structures Division, Sazeh Consultants Company
Position:	Senior Structural Engineer
Time period:	July 1999 - August 2000
Description:	• Dynamically analyzed and designed the residential buildings and high-rises. • Designed and programmed computer aided schemes to automatically design foundations.

Employer:	Mayfield Fellow 2007
Position:	Fellowship
Time period:	December 2007
Description:	A year-long mentorship program by Mayfield Fund, Walter A. Haas School of Business, company executives and Silicon Valley networks to provide the fellows with a broad entrepreneurship experience.

University:	University of California System - Berkeley
Time period:	2000 - 2001
Degree:	Civil Engineering, MSc

University:	University of California System - Berkeley
Time period:	2003 - Present
Degree:	Mechanical Engineering, PhD

Articles:

1. “A SiC MEMS Resonant Strain Sensor for Harsh Environment Applications”, Robert G. A., Student Member, IEEE; Debbie G. Jones; A. V. Jog; B. Jamshidi; D. R. Myers; L. Chen, X. Fu; M. Mehregany, Senior Member, IEEE; M. B. J. Wijesundara; and A. P. Pisano, IEEE Sensors Journal, Vol.7, No.4, April 2007. 2. “Silicon Carbide Coated MEMS Strain Sensor for Harsh Environment Applications”, Azevedo, R.G.; Zhang, J.; Jones, D.G.; Myers, D.R.; Jog, A.V.; Jamshidi, B.; Wijesundara, M.B.J.; Maboudian, R.; Pisano, A.P., 20th International Conference on Micro Electro Mechanical Systems (MEMS ‘07). 3. “Silicon Cross-Axis Rejection Capacitive Strain Gauge”, Jamshidi, B.; Azevedo, R.G.; Jog, A.V.; Pisano, A.P., Proceeding of ASME International Mechanical Engineering Congress and Exposition 2007. 4. “Corrosion Enhanced Capacitive Strain Gauge at 370oC”, Jamshidi, B.; Azevedo, R.G.; Wijesundara, M.B.J.; Pisano, A.P., The 6th Annual IEEE Conference on Sensors 2007. 5. “High Resolution Silicon Carbide Resonant Strain Gauge at 600°C”, K.B. Cheng; D. R. Myers; B. Jamshidi; Robert Azevedo; D.G. Jones; Mehran Mehregany; M. B. J. Wijesundara; A.P. Pisano, accepted to the 4th Asia- Pacific Conference on Transducers and Micro-Nano Technology, June, 2008, Taiwan.

Hobbies:

Soccer, skiing, basketball, tennis, biking, reading books and playing piano and synthesizer.

Memberships:

Member of Entrepreneur Association at Walter A. Haas School of Business Publication referee; Institute of Physics (IoP) Electronics Journals Member of the American Society of Mechanical Engineers (ASME) Member of the Institute of Electrical and Electronics Engineers (IEEE) Co founder and former board member of the Society of Iranian Engineers at Berkeley (SIEB), University ofCalifornia, Berkeley, CA.